EP-1260 key words: Low dielectric high heat resistance toughening crosslinking agent, toughening crosslinking agent, crosslinking toughening agent, high-frequency and high-speed copper-clad laminate, epoxy toughening agent, epoxy crosslinking agent, rheological modifier, flow modifier, viscosity modifier, epoxy diluent, electronic packaging adhesive, semiconductor packaging adhesive, 5G communication base station, vehicle radar, GPU、 NVIDIA, crosslinking agent, crosslinking degree regulator, crosslinking degree promoter; Wind power specific adhesive, anti fatigue structural adhesive, anti fatigue agent;
